TSC3PAK – New package from ROHM for SiC MOSFETs with top-side cooling

In high-performance applications, developers have often faced a trade-off: either traditional through-hole packages such as the TO-247 provided…
Read more
TSC3PAK

6 GOOD REASONS

FOR WEISBAUER ELEKTRONIK

icon-lieferantenkreis
icon-lieferzeiten
icon-kunde
icon-akkukompetenz
icon-logistikkonzepte
icon-service